Datacon Largest Provider of Semiconductor

Datacon is one of the leading and most innovative providers of assembly equipment for the semiconductor industry and is ahead of the field when it comes to new technologies such as flip chip and RFID (non-contact data transmission). Offering dynamic, flexible concept strategies and latest technologies, Datacon is known in the die bonder market as a solution supplier and an essential research partner for the semiconductor industry worldwide.

Flexible Die Attach by flexible-die-attach-solutions.com