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Flip Chip Die Bonder at flip-chip-die-bonder.com
Flip Chip Die Bonder at flip-chip-die-bonder.com

Flip Chip a Demanded Products

Datacon has always been committed to continuous research and development and ongoing product improvement. Right on track with industry demand, Datacon presents the quantum leap in flip chip production performance… the 8800 FC, the revolutionary platform setting new standards for dedicated, high volume flip chip production.
The 8800 FC dedicated flip chip platform offers a solution today to the flip chip market demands of tomorrow.

Flip Chip Wire Bonder by flip-chip-die-bonder.com

 
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